Experience Day: Advanced Packaging - Dresden

May 16, 2019

Regus Business Centre in Dresden Altmarkt 10 B/D

Free participation - Spaces are limited.

Join us for a day to get a free-of-charge hands-on experience and overview of CR-8000 Advanced Packaging.

A Zuken expert will provide you with an overview / training in English language using our Zuken solution supporting Advanced SiP design and synthesize Flip Chip design with Co-design.

 

Content included within this workshop:

  • New design methodology for SiP 
  • Support for wizards and parametric creation of IC’s, BGA package, and 3D wire-bond placement
  • Seamless connection of stacking IC’s and package on package (PoP)
  • Package-specific design rules with real-time 3D checks and view
  • Flip Chip I/O bump optimization 
  • I/O ring synthesis capability guarantees package routability
  • “Tile-based” die bump placement and optimization
  • Tape-out quality automatic routing for chip RDL and package escape routing



*Please note: The workshops do not replace the comprehensive training courses for users offered as part of Zuken's consulting, training and support offerings.


 

For details of alternative CR-8000 Experience Days, visit our web page: zuken.com/zed-cr


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